(-)-(8R,8'R)-3,3'-dimethoxy-9,9'-epoxylignane-4,4'-diol
CAS NO.: 29388-33-8
Purity :100%
Compound | SILICA | ||||
---|---|---|---|---|---|
CAS No. | 10279-57-9 | Catalog No. | ZS-GN01(PCB保护胶) | Brand | |
Purity | 98% | Packing | 1kg | Grade | |
Lead Time | 14Day (s) | Origin | Loading Port |
Boiling Point | 1610ºC(lit.) |
---|---|
Storage Condition | 2-8ºC |
Appearance & Physical State | white powder |
Refractive Index | n20/D 1.544(lit.) |
Density | 2.6 g/mL at 25ºC(lit.) |
Melting Point | >100ºC(lit.) |
Product Name: PCB protective glue
Two, product features:
Can be repeated operation without affecting the performance, high flexibility, good adhesion and high elongation
Three, the scope of application
PCB protective glue suitable for electronic components and combination from dust, moisture, shock and insulation protection; and heat conductive powder with a thermal gel, transistor and integrated circuit in coating material, transparent supply potting and encapsulation, elastic adhesive in optical instruments, silicone bra.
Four, typical physical properties
Serial number item number
Before application
Model ZS-GN02 ZS-GN01
1 appearance: (mixed curing transparent) A: transparent, transparent A: transparent B:, B: transparent
2 viscosity mPa (25 degrees C) A s 1002500 + 200 + 750
3 viscosity mPa (25 degrees C) B s 10055 + 5 + 750
4 specific gravity (g/cm3) 0.98+/-0.02 0.98+/-0.02
5 operation time 15~30min (30 C) 15~30min (30 C)
6 initial solid time 50~60 minutes (25 degrees C) 50~60 minutes (25 degrees C)
7 curing time 12 hours /25 C C, 60min/100 C 12 h /25 C C, 60min/100 C
After curing
8 penetration (25 C) 270 + 20270 + 20
9 flame retardant (ignition time: 10s) turn off time: < 16S turn off time: < 16S
10 curing time (H): "2H"
Whole solid: > 4H initial solid: < 2H
All solid: > 4H
Five, instructions for use
1, a and B glue according to 1:1 weight than the mixed drained after the bubble, in order to improve the exhaust velocity of bubble, bubble can stop stirring after emptying such repeated two to three times.
2, the substrate should be completely removed before filling the oil, dust and other impurities.
Six, matters needing attention
PCB protective glue is easy to tin, nitrogen, lead, cadmium and sulfur, poly sulfide, polysulfone, amine, polyurethane rubber or ammonia containing the items, phosphorous or containing phosphorous items, some flux residue pollution and affect the curing effect, so must ensure that cannot be more substances pollution.
Seven, packaging
PCB plastic packaging plastic packaging, specifications are 10kg/ group, 20 kg/ group, 40/50kg/ group.
Nine, save
1, PCB protective glue should be below 25 degrees Celsius, avoid light and sealed preservation.
2, PCB protection plastic storage period of 6 months from the date of making.
Ten, statement
The data contained in this article is for reference only, and is sure to be reliable, we will not be responsible for any of the results obtained by the method we can not control.
Zhaoshun technology supply: PCB glue
Product detail page: http://www.megasun-tech.com/about.html
Contact: Zheng Zhen
QQ:2731870546
Tel: 0769-88888312
Cell phone: 15112798306
Alibaba: www.zsilicone.cn
Source: Dongguan Zhaoshun silicone Polytron Technologies Inc
Zhao shun technology 15 years of silicone professional manufacturer, attention to electronics, led, home appliance, solar photovoltaic and industry, with clients provided all outstanding applications of experience, has a strong product development capabilities, get the industry recognized!
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